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Samsung Electronics on Thursday announced it has begun mass-producing logic chips on 3D packaging technology on 7-nanometer to better meet high-performance and multi-tasking on 5G, AI and other smart computing applications.

The chip dubbed X-Cube (eXtended-Cube) is built on 7nm and employs through-silicon via (TSV) technology to stack SRAM on top of a logic die, freeing up space to pack more memory into a smaller footprint. This means chip designers can enjoy greater flexibility to build custom solutions that best suit their unique requirements with Samsung’s X-Cube, the company said in a statement.

The ultra-thin package design features significantly shorter signal paths between the dies for maximized data transfer speed and energy efficiency. Customers can also scale the memory bandwidth and density to their desired specifications, according to the company.

Samsung X-Cube’s silicon-proven design methodology is available now for advanced nodes including 7nm and 5nm. Building on the initial design, Samsung said it will continue collaborating with global fabless customers to facilitate the deployment of 3D IC solutions in next-generation high-performance applications.

More details on Samsung X-Cube will be shared at Hot Chips, an annual conference on high-performance computing, which will be livestreamed on Aug. 16-18.

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